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Near infrared low coherence speckle interferometry (NIR-LCSI) as a tool for the investigation of silicon in solar cell production

Identifieur interne : 003C55 ( Main/Repository ); précédent : 003C54; suivant : 003C56

Near infrared low coherence speckle interferometry (NIR-LCSI) as a tool for the investigation of silicon in solar cell production

Auteurs : RBID : Pascal:11-0012473

Descripteurs français

Pascal (Inist)
- Speckle, Cellule solaire, Ouverture numérique, Imagerie, Interférométrie speckle, Méthode optique, Méthode mesure, Résolution spatiale, Composé ternaire, Gallium Arséniure, Indium Arséniure, Silicium, Topographie, As Ga In, InGaAs, 0130C, 0760, 0760L, 8460J, 4230M, Métrologie optique.

English descriptors

KwdEn :
- Gallium Arsenides, Imagery, Indium Arsenides, Measuring methods, Numerical aperture, Optical method, Optical metrology, Silicon, Solar cells, Spatial resolution, Speckle interferometry, Speckles, Ternary compounds, Topography.

Abstract

A setup for an NIR-LCSI instrument is introduced. It is based on a Superluminescence diode (SLD) (wavelength = 1280nm, FWHM = 50nm) and an InGaAs camera with VGA resolution. The paper presents a work in progress. The aim of the research work is to measure the chipping process in a Si wafer saw with high spatial resolution. Hereby the sawing channel inside the silicon block is investigated. The chipping generates a change of the interface topography of the sawing channel. NIR-LCSI will be applied to measure this topography change and contributes thus to determine the size and volume of the silicon chips and thus the cutting rate of the sawing process. This paper presents a novel concept to increase the spatial resolution of the imaging system. With the use of a new type of "immersion" optics the numerical aperture can be significantly increased and a spatial resolution close to, or even below, the nominal illumination wavelength can be obtained. The speckle size and the resulting spatial and depth resolution of the LCSI measurements are investigated.

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Pascal:11-0012473

Le document en format XML

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<author><name sortKey="Gastinger, Kay" uniqKey="Gastinger K">Kay Gastinger</name>
<affiliation wicri:level="1"><inist:fA14 i1="01"><s1>SINTEF ICT</s1>
<s2>Trondheim</s2>
<s3>NOR</s3>
<sZ>1 aut.</sZ>
<sZ>2 aut.</sZ>
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<country>Norvège</country>
<wicri:noRegion>SINTEF ICT</wicri:noRegion>
</affiliation>
</author>
<author><name sortKey="Johnsen, Lars" uniqKey="Johnsen L">Lars Johnsen</name>
<affiliation wicri:level="1"><inist:fA14 i1="01"><s1>SINTEF ICT</s1>
<s2>Trondheim</s2>
<s3>NOR</s3>
<sZ>1 aut.</sZ>
<sZ>2 aut.</sZ>
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<country>Norvège</country>
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<publicationStmt><idno type="inist">11-0012473</idno>
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<title level="j" type="abbreviated">Proc. SPIE Int. Soc. Opt. Eng.</title>
<title level="j" type="main">Proceedings of SPIE, the International Society for Optical Engineering</title>
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<profileDesc><textClass><keywords scheme="KwdEn" xml:lang="en"><term>Gallium Arsenides</term>
<term>Imagery</term>
<term>Indium Arsenides</term>
<term>Measuring methods</term>
<term>Numerical aperture</term>
<term>Optical method</term>
<term>Optical metrology</term>
<term>Silicon</term>
<term>Solar cells</term>
<term>Spatial resolution</term>
<term>Speckle interferometry</term>
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<term>As Ga In</term>
<term>InGaAs</term>
<term>0130C</term>
<term>0760</term>
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<front><div type="abstract" xml:lang="en">A setup for an NIR-LCSI instrument is introduced. It is based on a Superluminescence diode (SLD) (wavelength = 1280nm, FWHM = 50nm) and an InGaAs camera with VGA resolution. The paper presents a work in progress. The aim of the research work is to measure the chipping process in a Si wafer saw with high spatial resolution. Hereby the sawing channel inside the silicon block is investigated. The chipping generates a change of the interface topography of the sawing channel. NIR-LCSI will be applied to measure this topography change and contributes thus to determine the size and volume of the silicon chips and thus the cutting rate of the sawing process. This paper presents a novel concept to increase the spatial resolution of the imaging system. With the use of a new type of "immersion" optics the numerical aperture can be significantly increased and a spatial resolution close to, or even below, the nominal illumination wavelength can be obtained. The speckle size and the resulting spatial and depth resolution of the LCSI measurements are investigated.</div>
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<fC01 i1="01" l="ENG"><s0>A setup for an NIR-LCSI instrument is introduced. It is based on a Superluminescence diode (SLD) (wavelength = 1280nm, FWHM = 50nm) and an InGaAs camera with VGA resolution. The paper presents a work in progress. The aim of the research work is to measure the chipping process in a Si wafer saw with high spatial resolution. Hereby the sawing channel inside the silicon block is investigated. The chipping generates a change of the interface topography of the sawing channel. NIR-LCSI will be applied to measure this topography change and contributes thus to determine the size and volume of the silicon chips and thus the cutting rate of the sawing process. This paper presents a novel concept to increase the spatial resolution of the imaging system. With the use of a new type of "immersion" optics the numerical aperture can be significantly increased and a spatial resolution close to, or even below, the nominal illumination wavelength can be obtained. The speckle size and the resulting spatial and depth resolution of the LCSI measurements are investigated.</s0>
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<s5>19</s5>
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<s5>41</s5>
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<s2>NC</s2>
<s2>NA</s2>
<s5>52</s5>
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<s5>83</s5>
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<s4>INC</s4>
<s5>84</s5>
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Near infrared low coherence speckle interferometry (NIR-LCSI) as a tool for the investigation of silicon in solar cell production

Near infrared low coherence speckle interferometry (NIR-LCSI) as a tool for the investigation of silicon in solar cell production

Descripteurs français

English descriptors

Abstract

Links toward previous steps (curation, corpus...)

Links to Exploration step

Le document en format XML

Pour manipuler ce document sous Unix (Dilib)

Pour mettre un lien sur cette page dans le réseau Wicri